Diamond dimensions 21512/9/2022 Silicon microring resonators are measured after integration with the diamond film and show a low excess loss of 0.4 dB and a group index dispersion that is dependent on the mode confinement in the diamond layer. The quality of the diamond-silicon interface is measured using SEM and optical techniques. Here we show the fabrication and integration of a 1μm thick SC diamond membrane with a silicon photonic device. Limited dimensions of high optical quality diamond however restrict the size and number of devices that can be fabricated on a single chip, which impedes the use of diamond in large photonic integrated circuitry. Silicon microring resonators are measured after integration with the diamond film and show a low excess loss of 0.4 dB and a group index dispersion that is dependent on the mode confinement in the diamond layer.ĪB - The hybrid integration of single-crystal (SC) diamond membranes with on-chip optical devices will allow the demonstration of many applications such as scalable spin register entanglement. CAE has 1 wafer grinding, lapping & polishing currently available. CAE finds the best deals on used DIAMOND Z-810-215. CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. Limited dimensions of high optical quality diamond however restrict the size and number of devices that can be fabricated on a single chip, which impedes the use of diamond in large photonic integrated circuitry. Manufacturer: DIAMOND Model: Z-810-215 Category: WAFER GRINDING, LAPPING & POLISHING. N2 - The hybrid integration of single-crystal (SC) diamond membranes with on-chip optical devices will allow the demonstration of many applications such as scalable spin register entanglement. T1 - Thin film diamond membranes bonded on-demand with SOI ring resonators
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